Source follower circuit or bootstrap circuit, driver circuit comprising such circuit, and display device comprising such driver circuit

ABSTRACT

In the case of using an analog buffer circuit, an input voltage is required to be added a voltage equal to a voltage between the gate and source of a polycrystalline silicon TFT; therefore, a power supply voltage is increased, thus a power consumption is increased with heat. In view of the foregoing problem, the invention provides a depletion mode polycrystalline silicon TFT as a polycrystalline silicon TFT used in an analog buffer circuit such as a source follower circuit. The depletion mode polycrystalline silicon TFT has a threshold voltage on its negative voltage side; therefore, an input voltage does not have to be increased as described above. As a result, a power supply voltage requires no increase, thus a low power consumption of a liquid crystal display device in particular can be realized.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an analog buffer circuit such as asource follower circuit using a polycrystalline thin film transistor.The invention also relates to a signal driver circuit and an activematrix liquid crystal display device having the source follower circuitof the invention.

2. Description of the Related Art

Recently, a technology regarding a semiconductor device formed on aninsulating substrate by using a thin film transistor (hereinafterreferred to as a TFT) is rapidly developed. Further, as for asemiconductor device having a polycrystalline semiconductor film bymaking an amorphous semiconductor film into a polycrystallinesemiconductor film by heating or laser irradiation, a pixel portion anda driver circuit can be integrated; therefore, miniaturization andrealization of a narrower frame (to increase the ratio of the pixelportion to the display portion) of a semiconductor device are beingaimed at.

Meanwhile, a demand and expectation for a large semiconductor device in15 to 30 inches in size, especially for a liquid crystal display deviceare growing. Such a large liquid crystal display device is quite thin,light and flexible in design as compared with a CRT display device ofthe same size.

In such a large liquid crystal display device, as a signal line and ascan line become longer, a wiring resistance increases and a signal isdelayed due to the increased load. Therefore, a line sequential drive isperformed in which a signal is stored in a memory in a signal drivercircuit once and then written to a signal line. In this case, an analogbuffer circuit is required to be disposed next to the memory.

A thin film transistor can be used in this analog buffer circuit;however, characteristics of the thin film transistor vary. Therefore, amethod for correcting the variation of the thin film transistors issuggested. For example, the difference between a power supply voltageand a difference between an input voltage and a threshold voltage of atransistor is stored in a capacitor, and in the case of output, theinput voltage which cancels the threshold value is held by using thetransistor (refer to Patent Document 1).

Furthermore, in a source follower circuit configured with polysiliconTFTs, one end of a capacitor is connected to the gate of a sourcefollower transistor, a first analog switch is connected between the gateof the source follower transistor and a precharge power source, a secondanalog switch is connected between the other end of the capacitor andthe source of the source follower transistor, and a third analog switchis connected between the other end of the capacitor and a signal source.Thus, a precharge operation is performed and an offset is canceled at ahigh precision (refer to Patent Document 2). Patent Document 2 disclosesthat an NMOS transistor and the source follower transistor are coupledin a cascode configuration, a voltage Vgd between the gate and drain ofthe source follower transistor is maintained almost constant during theprecharge period and the output period, and a depletion mode transistoris used as this cascode connected NMOS transistor.

Patent Document 1: Japanese Patent Application Laid-open No.2000-194323

Patent Document 2: Japanese Patent Application Laid-open No.Hei 11-73165

SUMMARY OF THE INVENTION

These and other objects, features and advantages of the presentinvention will become more apparent upon reading of the followingdetailed description along with the accompanied drawings.

However, there is another problem besides the variation in the thresholdvoltage of TFT in the analog buffer circuit. That is, in the analogbuffer circuit, an input voltage is required to be added a voltagebetween the gate and source of the polycrystalline silicon TFT.Specifically, in the case of using an n-channel polycrystalline siliconTFT, the output potential is decreased by the voltage (V_(GS)) betweenthe gate and source of the TFT relatively to the input potential.Therefore, the input voltage is required to be increased by thedecreased voltage. As a result, a power supply voltage as well as apower consumption becomes large while generating heat.

Reasons for the abovementioned problem is described now. The voltage(V_(GS)) between the gate and source is a sum of a threshold voltage(V_(th)) which corresponds to a gate voltage when a drain current (ID)starts flowing, and a voltage at which the drain current reachessaturation. Therefore, a voltage (V_(GS)) between the gate and source isdependent on the threshold voltage.

Generally, an absolute value of the threshold voltage of an MOStransistor is approximately 0.3 to 0.7 V and a voltage (V_(GS)) betweenthe gate and source of an enhancement mode (normally OFF) n-channel MOStransistor is approximately 0.5 to 1 V. Whereas, a threshold voltage ofa polycrystalline silicon TFT is approximately 1.5 to 2 V, which resultsin a voltage (V_(GS)) between the gate and source of the enhancementmode n-channel TFT of 3 V or more.

This is because the threshold voltage of a polycrystalline silicon TFTof which channel forming region is formed of a polycrystalline siliconfilm becomes large and varies as a result of a process ofcrystallization and doping impurities, and the surface contamination andthe like of a gate insulating film and a semiconductor film.

That is, in the case of forming an analog buffer circuit by using apolycrystalline silicon TFT instead of a MOS transistor, a voltage(V_(GS)) between the gate and source of the polycrystalline silicon TFTbecomes large and a power supply voltage is increased.

Further, as an example of the analog buffer circuit, a source followercircuit having a constant current source and a TFT is describedspecifically.

FIG. 5A shows a configuration of a source follower circuit. The sourcefollower circuit shown is configured with a polycrystalline silicon TFT501 and a constant current source 502. Note that the TFT 501 may be ann-channel transistor or a p-channel transistor. The TFT 501 is turned ONor OFF by a potential (hereinafter referred to as an input potential:Vin) from an input terminal 503, and a voltage (hereinafter referred toas an output voltage: Vout) from an output terminal 504.

FIG. 5B shows a VG-ID characteristics of the n-channel polycrystallinesilicon TFT. The VG-ID characteristics of the TFT is set so that ID=0when VG=0. Thus, a polycrystalline silicon TFT which flows a large draincurrent (ID) in the case of applying a high voltage to the gate and doesnot flow a drain current in the case where the gate voltage is 0 V isreferred to as an enhancement mode TFT. The enhancement mode TFTcontrols the conductivity of a TFT by applying the gate voltage.

The TFT 501 used in the source follower circuit shown in FIG. 5A is anenhancement mode TFT. An input voltage having an amplitude of 5 V isinputted as shown in the left diagram of FIG. 5C, for example. Then, anoutput voltage is decreased by 3 V from an input voltage as a voltage(V_(GS)) between the gate and source of the TFT has a predeterminedvalue, for example 3 V (threshold voltage+several voltages). Thus, it isrequired that a potential of the constant current source 502 be −3 V,and a power source be 19 V in which 3 V is increased as shown in theright diagram of FIG. 5C. As a result, a power supply voltage of adisplay device and the like is increased, leading to a high powerconsumption.

Described above is the description of an n-channel polycrystallinesilicon TFT. A p-channel polycrystalline silicon TFT can be similarlydescribed by changing a conductivity.

As described above, a large liquid crystal display device is required tobe driven by the line sequential drive; therefore, an analog buffercircuit is required to be formed. In particular, using a polycrystallinesilicon TFT can realize an integration of a pixel portion and a drivercircuit, that is an analog buffer circuit. As an advantage of theintegrated liquid crystal display is a low power consumption, increasein power supply voltage as described above is a serious problem.

It is a feature of the invention to operate such an analog buffercircuit as a source follower circuit using a polycrystalline silicon TFTwithout increasing an input voltage. Further, it is another feature ofthe invention to provide a signal driver circuit and a liquid crystaldisplay device having the analog buffer circuit of the invention.

In view of the above-described problem, the invention provides apolycrystalline silicon TFT which is a depletion mode (normally ON) TFTused in such an analog buffer circuit as a source follower circuit.

A depletion mode polycrystalline silicon TFT (hereinafter referred to asa depletion mode TFT) has a threshold voltage on its negative voltageside. Therefore, a voltage (V_(GS)) between the gate and source of thedepletion mode TFT is approximately 0 to 1 V, which does not require anincrease in an input voltage as described above. As a result, a powersupply voltage does not have to be increased either, thus a low powerconsumption of a liquid crystal display device can be realized.

By using a polycrystalline silicon TFT, a monolithic liquid crystaldisplay device can be provided in which a pixel portion and an analogbuffer circuit, that is a driver circuit (also referred to as anelectric circuit) such as a signal driver circuit are integrated. It isneedless to say that a driver circuit having the analog buffer circuitof the invention may be formed separately from the pixel portion.

As for a channel forming region of a polycrystalline silicon TFT, apolycrystalline silicon film formed on an insulating surface (forexample a quartz substrate and the like) by CVD or the like, or apolycrystalline silicon film formed by crystallization by heating orlaser irradiating an amorphous silicon film formed on an insulatingsurface (for example a glass substrate) may be employed.

In the case of crystallizing by heating, a silicon film may be dopedwith metal element such as Nickel which is capable of promoting thecrystallization of a semiconductor film, and then heated at 450 to 580°C. for about 4 to 12 hours. In the case of crystallizing by laserirradiation, a silicon film may be irradiated by a continuousoscillation laser or a pulse oscillation laser such as an excimer laserand a YAG laser.

Note that referred to as a silicon film is a silicon-based semiconductorfilm, which may include germanium and the like. That is, a TFT of whichchannel forming region is formed of a polycrystalline semiconductor filmis referred to as a depletion mode TFT.

In the case of forming a depletion mode TFT, impurity may be doped atleast to the channel forming region of an active layer of the TFT at aconcentration of 5×10 ¹² to 5×10¹⁴ atoms/cm². As for the impurity,phosphorous (P) and boron (B) may be used to an n-channel depletion modeTFT and a p-channel depletion mode TFT respectively.

According to the invention as described above, a driver circuit using apolycrystalline silicon TFT can be operated without increasing a powersupply voltage than the desired value. As a result, power supply voltagecan be maintained low and a low power consumption can be realized in adisplay device such as a liquid crystal display device having the drivercircuit of the invention, a display device having a light emittingelement (referred to as a light emitting device), and a semiconductorintegrated circuit such as a CPU or a memory.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are diagrams showing a source follower circuit of theinvention.

FIG. 2 is a diagram showing a bootstrap circuit of the invention.

FIG. 3 is a diagram showing a signal driver circuit of the invention.

FIGS. 4A and 4B are diagrams showing a display device of the invention.

FIGS. 5A to 5C are diagrams showing a conventional source followercircuit.

FIGS. 6A to 6H are electronic apparatuses using the invention.

DETAILED DESCRIPTION THE INVENTION

Hereinafter described with reference to drawings are embodiment modes ofthe invention. It is to be understood that various changes andmodifications will be apparent to those skilled in the art. Therefore,unless otherwise such changes and modifications depart from the scope ofthe present invention hereinafter defined, they should be construed asbeing included therein. Note that, in all figures for describing theembodiment modes, the same reference numbers are used for devices orportions that have the same function. Descriptions about the samereference numbers are omitted.

EMBODIMENT MODE 1

A source follower circuit using a depletion mode TFT is described inthis embodiment mode.

FIG. 1A shows a source follower circuit having a depletion mode TFT 101of the invention, a constant current source 102, an input terminal 103,and an output terminal 104. Further, the depletion mode TFT 101 isconnected to a power supply line Vdd. Note that the depletion mode TFTin the drawings of the invention is described by using a symbol as thedepletion mode TFT 101.

Further, FIG. 1B shows a VG-ID characteristics of the depletion modeTFT. It is found when compared with FIG. 5B that a voltage (V_(GS))between the gate and source of the depletion mode TFT is quite small.That is, the voltage (V_(GS)) between the gate and source of thedepletion mode TFT is approximately 0 to 1 V; therefore, there is noneed to increase an input voltage as described above.

Furthermore, the constant current source 102 may employ a knowntechnique. In the case of using a polycrystalline silicon TFT inparticular, a depletion mode TFT is favorably employed.

A source follower circuit of the invention has a basic circuitconfiguration, and other circuits may be connected to it.

In this manner, by using a depletion mode TFT according to theinvention, an input voltage does not have to be increased and a lowpower consumption can be realized.

The above-described source follower circuit does not require complexconfiguration nor manufacturing process as compared with other analogbuffer circuits such as an operational amplifier circuit. Therefore, thesource follower circuit is applicable to a driver circuit having apolycrystalline silicon TFT and a signal driver circuit of a liquidcrystal display device in which a pixel portion is integrated.

Note that the invention is different from the invention disclosed inPatent Document 2 which employs a depletion mode transistor as an NMOStransistor in cascode connection in terms of configuration, problem, andeffect. That is, in view of the necessity of adding a voltage betweenthe gate and source of a polycrystalline silicon TFT to an input voltageof a source follower circuit, the invention employs a depletion modepolycrystalline silicon TFT as a transistor which is directly connectedto an output terminal of the source follower circuit (which correspondsto a source follower transistor in Patent Document 2). As a result, theinput voltage of the source follower circuit does not have to be added avoltage between the gate and source of the polycrystalline silicon TFT;therefore, a low power consumption can be realized.

EMBODIMENT MODE 2

In this embodiment mode, a bootstrap circuit using a depletion mode TFTis described.

FIG. 2 shows a bootstrap circuit having an n-channel depletion mode TFT201, a TFT 205, an n-channel enhancement mode TFT 202, an input terminal203, an output terminal 204, an input terminal 206, and a capacitor 207.The depletion mode TFT is connected to a power supply line Vdd.

A bootstrap circuit is operated with the gate voltage of a TFT connectedto a power supply line increased to be equal to or more than Vdd;however, it is difficult to actually increase a power sourcesufficiently due to a parasitic capacitance or the like. However, thedepletion mode TFT 201 of the invention does not require as large gatevoltage as an enhancement mode TFT. As described above, the depletionmode TFT has a characteristic that the threshold voltage is on itsnegative voltage side and a voltage (V_(GS)) between the gate and sourceis approximately 0 V, while a voltage (V_(GS)) between the gate andsource of an polycrystalline silicon TFT is several voltages. As aresult, the depletion mode TFT can be turned ON in a predeterminedregion of a power source VDD, thus the bootstrap circuit of theinvention can be operated.

The bootstrap circuit of the invention can be applied to a dynamiccircuit such as a shift register or a level shifter.

EMBODIMENT MODE 3

A signal driver circuit using the source follower circuit of theinvention is described in this embodiment mode.

FIG. 3 shows a signal driver circuit having a shift register 301, a NANDcircuit 307, and a buffer circuit 308.

First, a source start pulse SSP is inputted to a first stage of theshift register 301 through a switch 306. The switch 306 defines thescanning direction of the shift register 301. When a scanning directionswitching signal SL/R is Lo, scanning is performed from left to right inFIG. 3, and right to left when the signal is Hi. Each stage of the shiftregister 301 is configured with a DFF (delay flip flop) 302 havingclocked inverters 303 and 304 and an inverter 305. A pulse is shifted bythe inverters in accordance with an input of a clock pulse CL and CLb.

An output of the shift register 301 is inputted to the buffer circuit308 through the NAND circuit 307. Analog switches 309 to 312 are turnedON by an output of the buffer circuit 308, and then video signals aresampled to capacitors (hereinafter referred to as analog memories) 315to 318 which function as analog memories. After one line of data isaccumulated in the analog memories sequentially, signals of TRN and TRNbbecome active in the subsequent flyback period. Then, analog switches321 to 324 are turned ON. Thus, data in the analog memories 315 to 318are transferred to capacitors 325 to 328 as analog memories all at once.Such circuit that holds and transfers signals all at once is alsoreferred to as a latch circuit.

It should be noted that an amplitude of an input voltage can beincreased without increasing a power supply voltage, by using thebootstrap circuit using the depletion mode TFT as described inEmbodiment Mode 2 as a shift register.

For the next sampling, the analog switches 321 to 324 are turned OFFbefore the switches 309 to 312 are turned ON. The data in the analogmemories 325 to 328 are outputted to signal lines S1 to S4 throughsource follower circuits 330 to 333. The data in the analog memories 325to 328 are held for the period for one line; therefore, the sourcefollower circuits 330 to 333 can charge the signal lines spending theperiod for one line. Further, by using a source follower circuit havinga depletion mode TFT, a power supply voltage does not have to beincreased and a low power consumption signal driver circuit can beprovided.

In this manner, a line sequential drive can be performed by using ananalog memory and an analog buffer circuit. The above-described signaldriver circuit is applicable to a display device such as a large liquidcrystal display device in 15 inches or more and a light emitting device.

EMBODIMENT MODE 4

In this embodiment mode, a liquid crystal display device provided with asignal driver circuit having a source follower circuit of the inventionis described with reference to FIGS. 4A and 4B.

A liquid crystal display device of the invention comprises a pixelportion 402 on a substrate 401, in which a plurality of pixels arearranged in matrix, a signal driver circuit 403 of the invention, afirst scanning driver circuit 404 and a second scanning driver circuit405 in the periphery of the pixel portion 402. A signal is supplied tothe signal driver circuit 403 and the first scanning driver circuit 404and the second scanning driver circuit 405 externally through an FPC406. In FIG. 4A, the signal driver circuit 403 and the two scanningdriver circuits 404 and 405 are integrated with the pixel portion 402;however, the invention is not limited to this. The signal driver circuitand the scanning driver circuit can be designed in accordance with apixel configuration.

A configuration of a signal driver circuit is described with referenceto FIG. 4B. The signal driver circuit comprises a shift register 407, aswitch 408, an analog memory 409, and a source follower circuit 410. Theshift register 407 is configured with a plurality of stages of flip-flop(FF) circuits and the like and inputted with a clock signal (S-CLK), astart pulse (S-SP) and the like. A sampling pulse is outputted inaccordance with these signals. The outputted signals are inputted to theanalog memory 409 sequentially as described in Embodiment Mode 3, andoutputted to the signal lines S1, S2, . . . through the source followercircuit 410.

Each of the first scanning driver circuit 404 and the second scanningdriver circuit 405 comprise a shift register and a buffer circuit. Todescribe the operation briefly, the shift register outputs a samplingpulse sequentially in accordance with a clock signal (G-CLK), a startpulse (S-SP), and a clock inversion signal (G-CLKb). After that, asampling pulse is amplified in the buffer circuit and inputted to a scanline to be in a selected state one line at a time. A signal current iswritten from the signal lines sequentially in accordance with a timingat which a scan line is selected.

It should be noted that a level shifter circuit may be disposed betweenthe shift register and the buffer circuit. By disposing the levelshifter circuit, a voltage amplitude can be increased. The bootstrapcircuit of the invention can be applied to the level shifter.

EMBODIMENT MODE 5

Electronic apparatuses, each using an analog buffer circuit such as asource follower circuit of the invention, include a video camera, adigital camera, a goggle display (head mounted display), a navigationsystem, an audio reproduction device (car audio, audio component and thelike), a laptop personal computer, a game apparatus, a portableinformation terminal (mobile computer, portable telephone, portable gamemachine or electronic book and the like), an image reproductionapparatus having a recording medium (specifically, apparatus whichreproduces a recording medium such as Digital Versatile Disc (DVD) andthe like and has a display for displaying its images) and the like.Specific examples of these electronic apparatuses are shown in FIGS. 6Ato 6H.

FIG. 6A shows a liquid crystal display device, which includes a housing2001, a support table 2002, a display portion 2003, a speaker portion2004, a video input terminal 2005 and the like. The liquid crystaldisplay device comprising the source follower circuit of the inventioncan be applied to the display portion 2003. According to the invention,a thinner, lighter liquid crystal display device which consumes lesspower can be provided. Note that all televisions for displayinginformation, such as personal computer monitors, display devices forreceiving TV broadcasting, and display devices for advertising are alsoincluded.

FIG. 6B shows a digital still camera, which includes a main body 2101, adisplay portion 2102, an image-receiving portion 2103, operation keys2104, an external connection port 2105, a shutter 2106, and the like.The liquid crystal display device comprising the source follower circuitof the invention can be applied to the display portion 2102.

FIG. 6C shows a laptop personal computer, which includes a main body2201, a housing 2202, a display portion 2203, a keyboard 2204, anexternal connection port 2205, a pointing mouse 2206, and the like. Theliquid crystal display device comprising the source follower circuit ofthe invention can be applied to the display portion 2203.

FIG. 6D shows a mobile computer, which includes a main body 2301, adisplay portion 2302, a switch 2303, operation keys 2304, an infraredport 2305, and the like. The liquid crystal display device comprisingthe source follower circuit of the invention can be applied to thedisplay portion 2302.

FIG. 6E shows a portable image reproduction apparatus provided with arecording medium (specifically, a DVD reproduction apparatus), whichincludes a main body 2401, a housing 2402, a display portion A 2403, adisplay portion B 2404, a recording medium (such as a DVD) read-inportion 2405, an operation key 2406, a speaker portion 2407, and thelike. The display portion A 2403 mainly displays image information, andthe display portion B 2404 mainly displays text information. The liquidcrystal display device comprising the source follower circuit of theinvention can be applied to both of the display portions A 2403 and B2404. Note that image reproduction device provided with a recordingmedium includes game machines for domestic use and the like.

FIG. 6F shows a goggle display (head mounted display), which includes amain body 2501, a display portion 2502, an arm portion 2503, and thelike. The liquid crystal display device comprising the source followercircuit of the invention can be applied to the display portion 2502.

FIG. 6G shows a video camera, which includes a main body 2601, a displayportion 2602, a housing 2603, an external connection port 2604, a remotecontrol receiving portion 2605, an image receiving portion 2606, abattery 2607, an audio input portion 2608, an operation key 2609, andthe like. The liquid crystal display device comprising the sourcefollower circuit of the invention can be applied to the display portion2602.

FIG. 6H shows a mobile telephone, which includes a main body 2701, ahousing 2702, a display portion 2703, an audio input portion 2104, anaudio output portion 2705, an operation key 2706, an external connectionport 2707, an antenna 2708, and the like. The liquid crystal displaydevice comprising the source follower circuit of the invention can beapplied to the display portion 2703. Note that, by displaying whitecharacters on a black background, the power consumption of the mobiletelephone can be suppressed.

As described above, the invention can be applied to a wide range ofelectronic apparatuses in all fields. The electronic apparatuses in thisembodiment may employ any of the source follower circuit, the bootstrapcircuit, and the signal driver circuit described in Embodiment Modes 1to 4.

According to the invention, a driver circuit using a polycrystallinesilicon TFT can be operated without increasing a power supply voltagethan a desired value. As a result, a power supply voltage of a liquidcrystal display device having the driver circuit of the invention, adisplay device such as a light emitting device, and a semiconductorintegrated circuit such as a CPU, memory and the like can be maintainedlow, thus a low power consumption can be realized.

Furthermore, by using a polycrystalline silicon TFT, a display device inwhich a pixel portion and a driver circuit are integrated can beprovided.

1. A driver circuit comprising: a shift register; a buffer circuitelectrically connected to the shift register, comprising a sourcefollower circuit comprising an n-channel thin film transistor; and ananalog memory electrically connected to the buffer circuit, wherein: achannel forming region of the n-channel thin film transistor comprises apolycrystalline semiconductor, the n-channel thin film transistor is adepletion mode transistor, an active layer of the n-channel thin filmtransistor contains an impurity at a concentration in a range of 5×10¹²to 5×10¹⁴ atoms/cm², and as for the impurity, phosphorous is used to then-channel thin film transistor.
 2. The driver circuit according to claim1, wherein the n-channel thin film transistor is directly connected toan output terminal.
 3. The driver circuit according to claim 1, whereinthe polycrystalline semiconductor film is provided over either a quartzsubstrate or a glass substrate.
 4. The driver circuit according to claim1, wherein the semiconductor layer of the n-channel thin film transistorcomprises a metal element which is capable of promoting thecrystallization of a semiconductor film.
 5. The driver circuit accordingto claim 4, wherein the metal element is nickel.
 6. A driver circuitcomprising: a shift register; a buffer circuit electrically connected tothe shift register, comprising a source follower circuit comprising ann-channel thin film transistor; and an analog memory electricallyconnected to the buffer circuit, wherein: a channel forming region ofthe n-channel thin film transistor comprises a polycrystallinesemiconductor which is formed by crystallizing an amorphous silicon, then-channel thin film transistor is a depletion mode transistor, an activelayer of the n-channel thin film transistor contains an impurity at aconcentration in a range of 5×10¹² to 5×10 ¹⁴ atoms/cm², and as for theimpurity, phosphorous is used to the n-channel thin film transistor. 7.The driver circuit according to claim 6, wherein the n-channel thin filmtransistor is directly connected to an output terminal.
 8. The drivercircuit according to claim 6, wherein the polycrystalline semiconductorfilm is provided over either a quartz substrate or a glass substrate. 9.The driver circuit according to claim 6, wherein the semiconductor layerof the n-channel thin film transistor comprises a metal element which iscapable of promoting the crystallization of a semiconductor film. 10.The driver circuit according to claim 9, wherein the metal element isnickel.
 11. A driver circuit comprising: a shift register; a buffercircuit electrically connected to the shift register, comprising abootstrap circuit comprising an n-channel thin film transistor; and ananalog memory electrically connected to the buffer circuit, wherein: achannel forming region of the n-channel thin film transistor comprises apolycrystalline semiconductor, the n-channel thin film transistor is adepletion mode transistor, an active layer of the n-channel thin filmtransistor contains an impurity at a concentration in a range of 5×10¹²to 5×10¹⁴ atoms/cm², and as for the impurity, phosphorous is used to then-channel thin film transistor.
 12. The driver circuit according toclaim 11, wherein the n-channel thin film transistor is directlyconnected to an output terminal.
 13. The driver circuit according toclaim 11, wherein the polycrystalline semiconductor film is providedover either a quartz substrate or a glass substrate.
 14. The drivercircuit according to claim 11, wherein the semiconductor layer of then-channel thin film transistor comprises a metal element which iscapable of promoting the crystallization of a semiconductor film. 15.The driver circuit according to claim 14, wherein the metal element isnickel.
 16. A driver circuit comprising: a shift register; a buffercircuit electrically connected to the shift register, comprising abootstrap circuit comprising an n-channel thin film transistor; and ananalog memory electrically connected to the buffer circuit, wherein: achannel forming region of the n-channel thin film transistor comprises apolycrystalline semiconductor which is formed by crystallizing anamorphous silicon, the n-channel thin film transistor is a depletionmode transistor, an active layer of the n-channel thin film transistorcontains an impurity at a concentration in a range of 5×10¹² to 5×10¹⁴atoms/cm², and as for the impurity, phosphorous is used to the n-channelthin film transistor.
 17. The driver circuit according to claim 16,wherein the n-channel thin film transistor is directly connected to anoutput terminal.
 18. The driver circuit according to claim 16, whereinthe polycrystalline semiconductor film is provided over either a quartzsubstrate or a glass substrate.
 19. The driver circuit according toclaim 16, wherein the semiconductor layer of the n-channel thin filmtransistor comprises a metal element which is capable of promoting thecrystallization of a semiconductor film.
 20. The driver circuitaccording to claim 19, wherein the metal element is nickel.
 21. A drivercircuit comprising: a shift register; a buffer circuit electricallyconnected to the shift register, comprising a source follower circuitcomprising a p-channel thin film transistor; and an analog memoryelectrically connected to the buffer circuit, wherein: a channel formingregion of the p-channel thin film transistor comprises a polycrystallinesemiconductor, the p-channel thin film transistor is a depletion modetransistor, an active layer of the p-channel thin film transistorcontains an impurity at a concentration in a range of 5×10¹² to 5×10¹⁴atoms/cm^(2, and) as for the impurity, boron is used to the p-channelthin film transistor.
 22. The driver circuit according to claim 21,wherein the p-channel thin film transistor is directly connected to anoutput terminal.
 23. The driver circuit according to claim 21, whereinthe polycrystalline semiconductor film is provided over either a quartzsubstrate or a glass substrate.
 24. The driver circuit according toclaim 21, whereih the semiconductor layer of the p-channel thin filmtransistor comprises a metal element which is capable of promoting thecrystallization of a semiconductor film.
 25. The driver circuitaccording to claim 24, wherein the metal element is nickel.
 26. A drivercircuit comprising: a shift register; a buffer circuit electricallyconnected to the shift register, comprising a source follower circuitcomprising a p-channel thin film transistor; and an analog memoryelectrically connected to the buffer circuit, wherein: a channel formingregion of the p-channel thin film transistor comprises a polycrystallinesemiconductor which is formed by crystallizing an amorphous silicon, thep-channel thin film transistor is a depletion mode transistor, an activelayer of the p-channel thin film transistor contains an impurity at aconcentration in a range of 5×10¹² to 5×10¹⁴ atoms/cm², and as for theimpurity, boron is used to the p-channel thin film transistor.
 27. Thedriver circuit according to claim 26, wherein the p-channel thin filmtransistor is directly connected to an output terminal.
 28. The drivercircuit according to claim 26, wherein the polycrystalline semiconductorfilm is provided over either a quartz substrate or a glass substrate.29. The driver circuit according to claim 26, wherein the semiconductorlayer of the p-channel thin film transistor comprises a metal elementwhich is capable of promoting the crystallization of a semiconductorfilm.
 30. The driver circuit according to claim 29, wherein the metalelement is nickel.
 31. A driver circuit comprising: a shift register; abuffer circuit electrically connected to the shift register, comprisinga bootstrap circuit comprising a p-channel thin film transistor; and ananalog memory electrically connected to the buffer circuit, wherein: achannel forming region of the p-channel thin film transistor comprises apolycrystalline semiconductor, the p-channel thin film transistor is adepletion mode transistor, an active layer of the p-channel thin filmtransistor contains an impurity at a concentration in a range of 5×10¹²to 5×10¹⁴ atoms/cm², and as for the impurity, boron is used to thep-channel thin film transistor.
 32. The driver circuit according toclaim 31, wherein the p-channel thin film transistor is directlyconnected to an output terminal.
 33. The driver circuit according toclaim 31, wherein the polycrystalline semiconductor film is providedover either a quartz substrate or a glass substrate.
 34. The drivercircuit according to claim 31, wherein the semiconductor layer of thep-channel thin film transistor comprises a metal element which iscapable of promoting the crystallization of a semiconductor film. 35.The driver circuit according to claim 34, wherein the metal element isnickel.
 36. A driver circuit comprising: a shift register; a buffercircuit electrically connected to the shift register, comprising abootstrap circuit comprising a p-channel thin film transistor; and ananalog memory electrically connected to the buffer circuit, wherein: achannel forming region of the p-channel thin film transistor comprises apolycrystalline semiconductor which is formed by crystallizing anamorphous silicon, the p-channel thin film transistor is a depletionmode transistor, an active layer of the p-channel thin film transistorcontains an impurity at a concentration in a range of 5×10¹² to 5×10¹⁴atoms/cm², and as for the impurity, boron is used to the p-channel thinfilm transistor.
 37. The driver circuit according to claim 36, whereinthe p-channel thin film transistor is directly connected to an outputterminal.
 38. The driver circuit according to claim 36, wherein thepolycrystalline semiconductor film is provided over either a quartzsubstrate or a glass substrate.
 39. The driver circuit according toclaim 36, wherein the semiconductor layer of the p-channel thin filmtransistor comprises a metal element which is capable of promoting thecrystallization of a semiconductor film.
 40. The driver circuitaccording to claim 39, wherein the metal element is nickel.